微电子封装 CT 数字去翘曲：Dragonfly 实现 RBF 曲面拟合的层对齐可视化工作流Digital De-warping of X-ray CT Data for Layer-Aligned Visualization in Advanced Microelectronic Packages
英特尔的 Jose A. Perez Vacalla 与 Comet Technologies 的 Luke Hunter、Scott Eckley、Hubert Taieb、Zixiong Cao、Vineeth Bastin 合作，针对先进微电子封装翘曲造成的 X 射线 CT 数据几何畸变，提出了在 Dragonfly 3D World 软件中实现的数字去翘曲工作流：采用径向基函数（RBF）曲面拟合、变形场生成与体数据变换，将 CT 数据平面化，实现精确的层对齐分析。在倒装芯片针栅阵列（FCPGA）封装上的应用表明，该方法有效消除了跨层混合，显著提升了电源走线与互连等布线特征的可见度，为后续分割、特征提取与结构解读提供了更可靠的预处理步骤，同时强调了足够的体素分辨率的重要性。Jose A. Perez Vacalla (Intel) together with Luke Hunter, Scott Eckley, Hubert Taieb, Zixiong Cao, and Vineeth Bastin (Comet Technologies) present a digital de-warping workflow implemented in Dragonfly 3D World software to address geometric distortion in X-ray CT datasets of warped advanced microelectronic packages. Using radial basis function (RBF)-based surface fitting, deformation field generation, and volumetric transformation, the workflow planarizes CT volumes for accurate layer-aligned analysis. Applied to flip-chip pin grid array (FCPGA) packages, it eliminated cross-layer mixing and markedly improved the visibility of routing features such as power rails and interconnects, establishing an effective preprocessing step for more reliable segmentation, feature extraction, and downstream structural interpretation while emphasizing the importance of adequate voxel resolution.