ISTFA 2026 论文:在 Dragonfly 3D World 中实现 X 射线 CT 数据的数字矫形与分层可视化ISTFA 2026 Paper: Digital De-warping of X-ray CT Data for Layer-Aligned Visualization, Implemented in Dragonfly 3D World
先进微电子封装的翘曲会在 X 射线 CT 数据中引入几何畸变,导致各层混叠、难以判读。本研究在 Dragonfly 3D World 软件中实现了一套数字矫形工作流:基于径向基函数(RBF)的曲面拟合生成形变场,再对体数据做体积变换,得到平面化的 CT 数据以便逐层对齐分析。以倒装芯片针栅阵列(FCPGA)封装为例,该工作流显著改善了各封装层的分离与判读效果。Warpage in advanced microelectronic packages introduces geometric distortion in X-ray CT datasets, mixing layers and limiting interpretability. This work implements a digital de-warping workflow in Dragonfly 3D World software: radial-basis-function (RBF) surface fitting generates a deformation field that is applied to the volume, producing planarized CT data for layer-aligned analysis. Demonstrated on flip-chip pin grid array (FCPGA) packages, the workflow markedly improves isolation and interpretation of individual package layers.